SILCOOL TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping, pasty consistency offers physical stability that can allow improved processing. SILCOOL TIA241GF gap filler can be used as a liquid dispensed alternative to prefabricated thermal pads in a broad array of thermal designs for electronic applications.

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SAFETY DATA SHEETS
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TECHNICAL DATA SHEETS

SILCOOL™ TIA241GF

More About SILCOOL™ TIA241GF Silicone Gap FIller

Key Features & Typical Benefits

Good thermal conductivity
Fast, low temperature cure
Convenient 1:1 mix ratio by weight
Retained softness after cure for enhanced stress relief during thermal cycling
Excellent slump resistance (stays in place)
Repairability
Flame retardancy: UL94V-0 equivalent
Glass bead options available (180 & 250μm) for bond line thickness (BLT) control