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Automotive Silicones for Automotive Electronics

Silicones for Automotive Electronics

The automotive electronics industry is undergoing a paradigm shift. Significant changes to the powertrain have become necessary to take the next big step in CO2 reduction. This can only be achieved by introducing new technologies and propulsion concepts. The migration from internal combustion engines to full electric vehicles (EVs) is progressing in steps; 48V electrical systems will pave the way for medium voltage HEVs (hybrid electric vehicles) and high voltage, full electric vehicles.

Currently many OEMs are still facing challenges with:

  • Battery cost
  • Safety
  • Range
  • Charge time
  • Charging Infrastructure

Long term, full EVs are inevitable, as technologies are progressing, and costs are coming down. The ultimate goal is an optimized powertrain architecture with an affordable level of electrification.

Almost all innovations related to the reduction of CO2 emissions or the enhancement of safety, comfort and infotainment are based on electronics and/or software.

As space for additional components is limited and more and more systems are being introduced, miniaturization and system integration will drive the industry to new solutions.

These new components will be smaller, more powerful and more efficient. The higher energy density will translate to increased operating temperatures and heat output. In order to operate these new devices and maintain their performance over their lifetime, advanced thermal management solutions are necessary.

Momentive has a key focus on developing products with advanced thermal management properties.

The marketplace offers many material solutions to dissipate heat generated in circuit boards. The challenge is to find the best-suited thermal interface materials with favorable physical and thermal properties to help efficiently run vehicle electronics, as they must also be able to withstand thermal shock, physical vibration and atmospheric moisture.


Thermal Management Solutions for Automotive
Adhesives for Automotive Electronics
Optical Bonding for Automotive Displays
Encapsulation Materials for Automotive Electronics


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Featured Products

SNAPSIL™ TN3085

SNAPSIL TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature

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SILCOOL™ TIA350R Adhesive

Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

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SILCOOL™ TIA241GF Silicone Gap FIller

Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

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INVISISIL™ OP1012 Thermal Cure Optical Bonding Silicone

INVISISIL OP1012 optical bonding silicone is an optically clear gel used principally for touchscreen electronics and displays, featuring a stable modulus and low shrinkage.

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TIA225GF Liquid-Dispensed Silicone Thermal Pad

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.