Improve Device Reliability with SILCOOL™ Silicone Thermal Interface Solutions

In response to new heat-management challenges presented by higher frequencies and power, and increased miniaturization of today’s electronic devices, Momentive scientists have developed and continue to enhance our SILCOOL™ thermal interface materials. The excellent thermal conductivity and consistent, long-term heat transfer performance provided by SILCOOL™ products can enable such devices to operate more efficiently and reliably. Our complete SILCOOL™ product portfolio, which includes grease compounds, adhesives, encapsulants and potting compounds, and liquid dispensed thermal pads, also offers excellent workability, thin bond lines and minimal weight loss at elevated temperatures.

Along with excellent thermal conductivity, SILCOOL™ grease compounds offer low bleed as well as great stability, penetration and temperature resistance. The combination of processing performance and thermal conductivity exhibited by these grease compounds, make them particularly attractive candidates for high-performance devices and packages.

Quick-curing SILCOOL™ silicone adhesive products can allow thin bond lines that will generally contribute to low thermal resistance, as well as provide excellent adhesion and reliability. They can adhere well to ceramics, glass and most metals (including aluminum, copper and nickel plate), without the use of primers, and without causing corrosion to most metal substrates. In addition, SILCOOL™ silicone adhesive products offer excellent adhesion to many high-performance thermoplastics, such as PPS and PBT.

SILCOOL™ silicone potting compounds, encapsulants and liquid dispensed thermal pads include a variety of heat and room temperature cure materials. Low-viscosity grades are available for potting applications, and moderate-viscosity grades can provide the necessary dispensing stability for bead formulation. Forming a stress-relieving rubber, these SILCOOL™ grades can also be considered for use as gap fillers or as liquid-dispensed alternatives to thermal pads.

The highly workable nature of SILCOOL™ products can help effectively accommodate automated dispensing, screen printing and stamping. SILCOOL™ silicone products are excellent candidates for electronic and other applications where thermal management and high-heat transfer are critical.

The SILCOOL™ brand of thermal interface materials is used across many industries, such as energy, power, utilities, telecom, microelectronics, aerospace, automotive, renewable energy, consumer electronics and health care. Potential applications include assembly adhesion, board assembly and manufacturing of flat-panel monitors, photovoltaic components and hybrid car parts.

Discover how products in the versatile SILCOOL™ brand can meet thermal management objectives.