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Silicone Solutions for Electronics and Home Appliances

Momentive Silicone Technologies for Home Appliances and Electronics: Thermal Management and Durability

Momentive offers an array of electronic silicone materials for home appliance applications. Our materials can help improve the reliability and performance of appliances as well as enable design flexibility.

UV Dual Cure Silicone Encapsulants and Adhesives

Momentive's UV cure encapsulants and adhesives employ a two-step cure system that helps improve the efficiency of PCB assembly processes. After dispensing, an initial fast cure can be achieved with UV exposure to become a stable elastomer. Then a secondary cure mechanism gradually continues at room temperature, providing additional adhesion strength and protection.

 

Other Silicone Solutions for Home Appliances

  • Thermal Management: SILCOOL™ thermally conductive greases and potting compounds in the 1~2 W/m.K level are frequently used in a wide array of appliances to help reduce operating temperatures and extend product life.
  • Heat Resistant Adhesives & Sealants: For applications such as ovens, stoves cookers or other heating devices, Momentive offers adhesives and sealants that can help enhance retention of performance at elevated temperatures. Both room temperature and heat cure formulations are available.
  • Conformal Coatings: Momentive's ECC conformal coatings are used to protect PCBs against particles, moisture, gases and other potentially contaminating materials. In particular, ECC3011 and ECC3051S conformal coatings employ a distinct formulation that offers inherent resistance against elements that cause corrosion on vital PCB components.
  • Room Temperature Cure Adhesives & Sealants: Momentive offers a wide range of adhesives and dielectric encapsulants that are used for structural bonding, to provide mechanical strength to PCB components, insulate and protect against corrosion, and provide mild thermal conductivity.
  • Transparent Potting Materials: Momentive's optically clear potting materials are used to encapsulate LED arrays or strips to help provide protection against a number of elements and enable components to withstand temperature extremes. These low viscosity materials cure with exposure to heat, and can also provide adhesion when used in conjunction with primers.