Thermal Management Silicones

In response to new heat-management challenges arising from the higher frequencies, power and miniaturization of today’s electronic devices, Momentive scientists have developed and continue to enhance our SILCOOL™ thermal interface materials. The excellent thermal conductivity and consistent, long-term performance offered by SILCOOL products can help improve efficiency and reliability of your electronic assembly.

Our products, which include grease compounds, adhesives, encapsulants and potting compounds, liquid dispensed thermal pads, and high thermal gap fillers are also typically characterized by excellent workability, thin bond lines and minimal weight loss at elevated temperatures.

These materials can support a range of applications, such as:

• Automotive and Transportation
• Aerospace
• Electronics and Home Appliances
• Telecommunications