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Solutions for Integrated Circuit (IC) Packaging and Micro Electro-Mechanical Systems (MEMS)
Silicone materials play a critical role in protecting and enhancing the performance of semiconductor devices. From thermal management to mechanical protection, Momentive’s silicone-based technologies help deliver reliability and long-term durability in IC packaging and MEMS applications. As devices become smaller and more powerful, the demand for high-performance materials that can withstand thermal, mechanical, and environmental stresses continues to grow.
Supporting everything from heat dissipation to structural bonding and environmental sealing, silicone technologies enable a wide range of essential functions in semiconductor packaging. Whether managing thermal loads in high-density ICs, absorbing mechanical stress, or shielding delicate features from moisture and contaminants, these materials are engineered for consistent performance across demanding application environments.
As modern devices demand higher operating power, effective thermal management has become essential, especially for flip-chip IC packages used in telecom, networking, and high-performance computing. Momentive’s silicone-based thermal interface materials (TIMs) are engineered to help address the unique challenges of today’s complex package designs.
Newer chip designs generate more heat, with increasingly irregular “hot spots” due to wider and more complex layouts. Our TIM solutions offer excellent thermal conductivity, helping dissipate heat more efficiently, even in applications with high power densities or less-than-ideal bond line thickness (BLT).
Wider chip packages are more prone to warping during operation. Traditional gel-based TIM materials used in TIM1 applications struggle to handle the strain, often leading to delamination. Momentive’s adhesive-type TIMs offer improved mechanical stability, maintaining adhesion between the lid and die, especially critical for flat-lid package types.
In demanding environments like automotive applications, gel-based TIMs can lose performance due to hardness changes over time. In contrast, Momentive’s silicone adhesives have demonstrated strong reliability in Thermal Cycling with Bending (TCB) and High Temperature Storage (HTS) tests.
Our TIM materials use carefully sized and shaped fillers to maintain a consistent BLT, which is a key factor in achieving both thermal and mechanical performance in large-area packages.
Attaching the lid to the die is a critical step in flip-chip IC packaging, especially for large or thin chips that must withstand high reflow temperatures. Momentive’s silicone adhesives are engineered to deliver strong, reliable bonding with low stress and excellent thermal stability.
These adhesives offer low viscosity and low modulus to minimize mechanical stress, excellent adhesion to substrates like aluminum, copper, FR4, ceramic, and glass, and high purity with minimal oil bleeding and ionic contaminants. Their thixotropic behavior helps ensure precise dispensing while preventing undesired flow or bleed.
These materials are well-suited for semiconductor packages using flat lids, molded packages, or large die sizes. They perform well across a range of process conditions, including high adhesion after curing at 150°C for 30 minutes, and good bonding even with lower temperature cure (100°C for 90 minutes). They are capable of maintaining a controlled bond line thickness (BLT) greater than 30 μm, even across large package sizes.
With long pot life and easy dispensability, these adhesives can help boost productivity, support warpage control, and integrate smoothly into high-throughput processes.
In semiconductor and MEMS packaging, coating and encapsulation materials must offer both electrical insulation and mechanical protection, especially for sensitive wire-bond packages and microstructures. Momentive’s silicone-based gels provide flexible, reliable coverage while minimizing contamination and mechanical stress.
These materials are formulated as soft to medium-consistency gels, ideal for glob top applications or flow control layers over delicate structures. They are thixotropic, meaning they stay in place after dispensing, reducing the risk of overflow or contact with critical features.
Key properties include electrical insulation, thixotropic flow control, low viscosity for jetting, soft to medium gel hardness, shock absorption, environmental protection, long pot life, and cure flexibility including UV or temperature-activated systems.
These materials protect fine wire bonds and MEMS features from mechanical damage, maintain clean coverage with minimal bleeding, and enhance long-term reliability in harsh environments.
Momentive Performance Materials offers a comprehensive portfolio of semiconductor packaging adhesives designed to meet diverse performance needs in today’s advanced electronic components and assemblies. These silicone adhesives provide an alternative to conventional epoxy-based die attach materials, delivering high thermal stability, UV resistance, and minimal yellowing over time.
Compared to epoxies, Momentive silicones help improve long-term device reliability by maintaining stable adhesion and optical clarity, especially in applications sensitive to heat or light degradation.
Example Applications
Explore our full line of semiconductor packaging adhesives to find the right match for your application needs.
As a premier global high-performance Silicones and specialities company, Momentive creates solutions that improve the quality of life for people and enable a more sustainable future.
