SILCOOL™ Thermally Conductive Gap Fillers for the Information and Communication Technology industry (ICT)

Momentive’s SILCOOL gap fillers are used to fill air gaps and voids to create heat paths, and are excellent candidates for applications where low stress and good interface wetting are required. These products further offer tacky adhesion for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and CTE (coefficient of thermal expansion) mismatch. SILCOOL gap fillers are available in curing type 2-part or pre-cured 1-part formulations, and offer exceptional performance in terms of reliability, adhesion, and thermal resistance.